creat by art - glass passivated junction chip - ideal for automated placement - low profile package - low power loss, high efficiency - halogen-free according to iec 61249-2-21 molding compound: ul flammability classification rating 94v-0 moisture sensitivity level: level 1, per j-std-020 packing code with suffix "g" means green compound (halogen-free) terminal: matte tin plated leads, solderable per j-std-002 meet jesd 201 class 1a whisker test symbol es1df ES1GF es1jf unit v rrm 200 400 600 v v rms 140 280 420 v v dc 200 400 600 v i f(av) a c j pf t rr ns t j c t stg c version: b1604 maximum ratings and electrical characteristics (t a =25c unless otherwise noted) es1df - es1jf 1a, 200v - 600v surface mount super fast rectifiers features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec mechanicaf data smaf a maximum rms voltage maximum dc blocking voltage maximum average forward rectified current peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load 1.70 1 30 1.00 1.30 maximum reverse recovery time (note 3) 9 r jl r ja maximum reverse current @ rated v r t j =25c t j =125c i r case: smaf maximum repetitive peak reverse voltage parameter polarity: indicated by cathode band weight: 35 mg (approximately) a maximum instantaneous forward voltage (note 1) @ 1 a v f v c/w 100 35 i fsm typical junction capacitance (note 2) typical thermal resistance note 3: test conditions: i f =0.5a, i r =1.0a, i rr =0.25a taiwan semiconductor 35 85 operating junction temperature range storage temperature range note 1: pulse test with pw=300s, 1% duty cycle - 55 to +150 - 55 to +150 5 note 2: measured at 1 mhz and applied v r =4.0 v
note 2: whole series with green compound fig 1 fig.2 version: b1604 r3 g r3 example example p/n es1df - es1jf taiwan semiconductor ordering information packing code packing code suffix package packing part no. r2 10,000 / 13" paper reel note 1: "x" defines voltage from 200v (es1df) to 600v (es1jf) smaf 3,000 / 7" plastic reel smaf g green compound ratings and characteristics curves (t a =25c unless otherwise noted) es1xf (note 1, 2) es1df part no. es1df r3g packing code packing code suffix description 0 0.2 0.4 0.6 0.8 1 1.2 0 25 50 75 100 125 150 average forward current (a) lead temperature ( c) fig.1 forward current derating curve resistive or inductive load 0 5 10 15 20 25 30 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 3 maximum non - repetitive forward surge current 8.3ms single half sine wave 0.01 0.1 1 10 100 0 20 40 60 80 100 instantaneous reverse current (a) percent of rated peak reverse voltage (%) fig. 4 typical reverse characteristics t j =125 c t j =25 c 0.1 1 10 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 instantaneous forward current (a) forward voltage (v) fig. 2 typical forward characteristics es1jf pulse width=300s 1% duty cycle
min max min max a 1.25 1.60 0.049 0.063 b 2.40 2.80 0.094 0.110 c 3.30 4.30 0.130 0.169 d 0.90 1.10 0.035 0.043 e 0.10 0.25 0.004 0.010 f 0.70 1.20 0.028 0.047 g 4.40 5.20 0.173 0.205 marking diagram p/n = specific device code g = green compound code yw = date code f = factory code version: b1604 smaf dim. unit (mm) unit (inch) es1df - es1jf taiwan semiconductor package outline dimensions 0 5 10 15 20 25 30 0.1 1 10 100 capacitance (pf) reverse voltage (v) fig. 5 typical junction capacitance f=1.0mhz vsig=50mvp - p
creat by art assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied, to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. version: b1604 es1df - es1jf taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
|
